LOGO
Total0Items      Cart Subtotal:$0
LOGO
BGA-STD-115
BGA-STD-115Reference image

Images are for reference only

Mfr. #:
BGA-STD-115
Batch:
new
Description:
Heat Sink, Ball Grid Array, Standard, 8.2 °C/W, BGA, 40 mm, 18 mm, 40 mm
Datasheet:
Request Quote
Part Number*Qty*ManufacturerTarget Price
Please provide your contact information and get back to you as soon as possible
Specifications
frequently asked question
Product AttributeAttribute Value
Thermal resistance 8.2°C/W
Coolable package BGA
External width - Metric 40mm
External height - Metric 18mm
Other product information

Advantage price,BGA-STD-115 in stock can be shipped on the same day

In Stock: 557
Qty.Unit PriceExt. Price
1+ $2.6201 $2.6201
100+ $2.5151 $251.51
250+ $2.4483 $612.075
500+ $2.3593 $1179.65
Enter Quantity:
Unit Price:
$0.47
Ext. Price:
$0.94
In Stock:
557
Minimum:
1
MPQ:
1
Multiples:
1
Copyright © 2016-2025 Shenzhen Xinze Shengshi Technology Co., Ltd